Machine Customization
Custom-Made Solutions tailored for you
Machine Customization - Tailored for you
At Mikrotools, we support our customers in achieving their precision machining goals by developing custom-built machines tailored to their unique applications. We have designed and manufactured ultra-precision grinding machines (UPG) and wafer-slicing machines specifically for the semiconductor industry.
Collaborating closely with our customers, we deliver cost-effective, high-quality solutions, carefully selecting the most appropriate components for machine assembly based on the specific machining processes.
We are deeply involved in Hardware-Software integration to offer advanced, user-friendly Graphical User Interfaces (GUI), customized to meet the needs of each process and its intended use.
Hybrid LBMM μEDM Machine
The hybrid LBMM-μEDM machine is the result of a collaborative effort between Mikrotools and IIUM to advance precision machining technology. By seamlessly integrating laser beam micro-machining (LBMM) and micro electro-discharge machining (μEDM), this innovative machine tool is designed to produce high-quality micro-machined components. Harnessing the strengths of both LBMM and μEDM processes, it delivers exceptional precision and efficiency.
Hybrid Laser-EDM Machine
Features
- Laser spot size of 50μm
- Laser stage repeatability accuracy of 1μm
- μEDM stage of repeatability accuracy of 1.5μm
- Fully intergrated in-house Graphical User Interface (GUI) for full control of the system.
